Ceramic structure using a support sheet

ABSTRACT

The present invention relates generally to a new ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of a stronger support sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin green sheets were tacked/bonded to thicker and stronger support sheets to form a sub-structure which had excellent stability in screening and enabled further processing. The sheets are anchored or pinned in such a way as to allow the processing of the green sheet with the subsequent easy removal of the support sheet.

FIELD OF THE INVENTION

[0001] The present invention relates generally to a new ceramicstructure and process thereof. Basically, the present invention relatesto a structure and method for forming laminated structures and moreparticularly to a structure and method for fabricating multi-layerceramic products using very thin green sheets and/or green sheets withvery dense electrically conductive patterns on top of a stronger supportsheet.

BACKGROUND OF THE INVENTION

[0002] Multi-layer ceramic (MLC) structures are used in the productionof electronic substrates and devices. The MLCs can have various layeringconfigurations. For example, a MLC circuit substrate may comprisepatterned metal layers which act as electrical conductors sandwiched inbetween ceramic layers which act as a dielectric medium. For thepurposes of interlayer interconnections, most of the ceramic layers havetiny holes or via holes. Prior to lamination, the via holes are filledwith an electrically conductive paste, such as, a metallic paste, andsintered to form vias which provide the electrical connection betweenthe layers. In addition, the MLC substrates may have termination padsfor attaching semiconductor chips, connector leads, capacitors,resistors, to name a few.

[0003] Generally, conventional ceramic structures are formed fromceramic green sheets which are prepared from a slurry of ceramicparticulate, thermoplastic polymer binders, plasticizers, and solvents.This composition is spread or cast into ceramic sheets or slips fromwhich the solvents are subsequently volatilized to provide coherent andself-supporting flexible green sheets. After punching, metal pastescreening, stacking and laminating, the green sheets are fired orsintered at temperatures sufficient to burn-off or remove the unwantedpolymeric binder resin and sinter the ceramic particulate together intoa densified ceramic substrate. The present invention is directed to thescreening, stacking and lamination steps of this process.

[0004] In the MLC packaging industry it is very common to use greensheets of various thicknesses. The thicknesses can typically vary from 6mils to 30 mils and in general the art of punching and metallizing theselayers are well known. Green sheet thicknesses below 6 mils, in general,are very scarcely used. This is due to a variety of reasons, such as,for example, handling, screening and stacking of green sheets thinnerthan 6 mils pose tremendous challenges. In fact the use of one to twomils thick ceramic green sheets, which are punched and screened, usingtraditional MLC technology does not exist in the prior art.

[0005] Also, in the MLC packaging industry it is very common to usecapacitor layers. The capacitance necessary in a package depends on thedesign and such capacitance is obtained by choosing proper dielectriclayer thickness and metal area within a layer. The industry is alwaysstriving for higher capacitance and since the metal area is maxing outfor a given substrate size it is necessary to use thinner dielectriclayers between electrodes to obtain the required capacitance. Forexample, as a rule of thumb one could double the capacitance for a givendielectric system and electrode metal area by decreasing the dielectriclayer thickness by half. Additionally the number of layers needed forcapacitance in a package as well has been reduced by about 50 percent.

[0006] The reduction in the number of layers is desirable, as it reducesthe cost and the process of making the substrate.

[0007] The term thin sheet or layer as used herein means that thethickness of the sheet can be anywhere from about 0.5 mil to about 6.0mils. Production level screening and stacking of thin sheets is notpossible with the current technology as the thin sheets tend to shrink alot and they also tend to distort during the process.

[0008] U.S. Pat. No. 5,176,772 (Ohtaki) and U.S. Pat. No. 5,300,163(Ohtaki), addresses a method of forming a thin sintered ceramic board bylaminating punched and screened green tapes on a presintered ceramicbody and sintering the assembly to obtain a flat board. This methodessentially enables one to obtain a flat laminate. But, with ceramicsubstrates with materials like alumina and aluminum nitride there istypically a 14 to 20 percent X—Y shrinkage. So there will bedelamination and distortion involved in sintering due to presinteredbase. Furthermore, one needs to handle these sheets through screening infree standing state.

[0009] U.S. Pat. No. 5,368,667 (Minh), teaches preparing a multi-layercapacitor which is one to two mils thick by extruding a thick dielectriclayer and a metal containing layer through a roll laminator. Thisapproach is good for using a thin layer having the blanket metallurgy.But in almost all multi-layer ceramic packages, one needs to have viasfor electrical connectivity. However, this patent does not address theproblem of handling the thin sheets in via filling and stacking.

[0010] U.S. Pat. No. 5,480,503 (Casey), teaches releasably-supportingthe thin green sheets on a temporary carrier support having an ablatablerelease layer over a patterned conductive layer, and filling the viaswith conductive metal paste, whereby the thin green sheets are supportedagainst warpage and distortion. The supported green sheets are formed assingle layers, pairs and stacks thereof, and separated from temporarysupport for use. The suggested temporary support is a glass plate. Themetallization technique is CVD type plating and in the process has touse non-ablatable and ablatable films on the green sheet. These filmsinherently will distort the green sheet during temperature and pressureprocessing. Furthermore, the non-ablatable film stays with every singlegreen sheet layer and will create delamination and density difference insintering.

[0011] U.S. Pat. No. 5,976,286 (Natarajan), assigned to InternationalBusiness Machines Corporation, Armonk, N.Y., USA, the disclosure ofwhich is incorporated herein by reference, teaches the use of at leastone thin green sheet and a thick green sheet for fabricating amulti-density sub-structure.

[0012] The structure and method of the present invention enables thescreening, stacking and handling of very thin green sheets and/or greensheets with very dense metallized patterns in the manufacture ofmulti-layer ceramic packages. With the preferred embodiment, thin greensheets were tacked and bonded to a support sheet, such as, a thin metalor a like carrier, to form a sub-structure which yields excellentstability in screening and enables excellent handling and alignment instacking. The green sheet may have electrically conductive featureswithin them, such as, a via, or over them, such as, a line, cap, to namea few.

PURPOSES AND SUMMARY OF THE INVENTION

[0013] Bearing in mind the problems and deficiencies of the prior art itis therefore one purpose of the present invention to provide a novelmethod and structure for producing metallized thin green sheetsincluding sub-structures in multi-layer ceramic packages as capacitorlayers or with fine line patterned conductive metal layers

[0014] Another purpose of this invention is to provide a structure and amethod that will ensure multiple thin layers in a multilayer ceramicpackage.

[0015] Still another purpose of the present invention is to provide astructure and method that will ensure higher capacitance in amulti-layer ceramic package.

[0016] Yet another purpose of the present invention is to have astructure and a method for fine line pattern using thin green sheets inmulti-layer ceramic packages.

[0017] Still yet another purpose of the present invention is to providea structure and a method for metallizing a thin green sheet without anydetrimental distortion.

[0018] Still another purpose of the present invention is to have astructure and a method that will ensure handling of thin green sheetsfor multi-layer ceramic packages.

[0019] It is another purpose of the invention to have a structure and amethod that produces a multilayer ceramic package that is predictableand repeatable.

[0020] Another purpose of the present invention is to laminate severalstacked green sheets to produce sub-structures.

[0021] Other purposes, objects and advantages of the present inventionwill in part be obvious and will in part be apparent from thespecification.

[0022] Therefore, in one aspect this invention comprises a method forfabricating a ceramic substrate comprising the steps of:

[0023] (a) applying at least one thin photosensitive polymer layer overa support sheet,

[0024] (b) forming at least one opening in said thin photosensitivepolymer layer and said support sheet,

[0025] (c) filling said at least one opening with at least oneelectrically non-conductive paste,

[0026] (d) placing at least one green sheet over said at least onephotosensitive polymer layer and said paste,

[0027] (e) opening at least one through-hole through said green sheet,such that at least a portion of said electrically non-conductive pasteremains adhered to at least a portion of the side-wall,

[0028] (f) filling said opening with at least one electricallyconductive paste, and thereby fabricating said ceramic substrate.

[0029] In another aspect this invention comprises a ceramic substratecomprising at least one green sheet with at least one via hole having atleast one electrically conductive material in intimate contact with atleast one carrier support sheet, and wherein said carrier support sheethas at least one via opening which is filled with an electricallyconductive material and an electrically non-conductive material andwherein at least a portion of said at least one electrically conductivematerial is surrounded by at least a portion of at least oneelectrically non-conductive material, and thereby forming said ceramicsubstrate.

[0030] In yet another aspect this invention comprises a ceramicsubstrate comprising at least one green sheet with at least one via holehaving at least one electrically conductive material in intimate contactwith at least one metal carrier support sheet, and wherein said metalcarrier support sheet has at least one via opening which is filled withan electrically conductive material and an electrically non-conductivematerial and wherein at least a portion of said at least oneelectrically conductive material is surrounded by at least a portion ofat least one electrically non-conductive material, and thereby formingsaid ceramic substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The features of the invention believed to be novel and theelements characteristic of the invention are set forth withparticularity in the appended claims. The drawings are for illustrationpurposes only and are not drawn to scale. Furthermore, like numbersrepresent like features in the drawings. The invention itself, however,both as to organization and method of operation, may best be understoodby reference to the detailed description which follows taken inconjunction with the accompanying drawings in which:

[0032]FIG. 1, illustrates a thin photosensitive polymer layer over athin support sheet.

[0033]FIG. 2, illustrates openings in the structure of FIG. 1.

[0034]FIG. 3, illustrates an optional step of adhering a layer in theopen areas.

[0035]FIG. 4, illustrates the insertion of paste in the openings.

[0036]FIG. 5, illustrates the adhering of a green sheet over thestructure shown in FIG. 4.

[0037]FIG. 6, illustrates the formation of openings in the structureshown in FIG. 5.

[0038]FIG. 7, illustrates the filling of the openings in the structureof FIG. 6.

[0039]FIG. 8, illustrates the joining of two structures of FIG. 7.

[0040]FIG. 9, illustrates the joined structures of FIG. 8, after theremoval of the thin support sheet.

DETAILED DESCRIPTION OF THE INVENTION

[0041] The structure and method of the present invention enables thehandling, screening and stacking of thin ceramic layers. These thinceramic layers are used in the semiconductor industry for a variety ofpurposes, such as, for example, for a capacitor structure, or for a fineline pattern structure in MLC packages, to name a few. Basically, theinvention is a novel structure and method where a support sheet, suchas, a thick or a thin metal sheet, is used as a base or a support for athinner ceramic green sheet layer. Additionally, the support sheet orthe base acts as a shrinkage and distortion restrainer when the thinnerceramic sheet is screened with conductive paste and dried. Furthermore,the thinner green sheet on the thin support base totally eliminateshandling problems, such as, for example, in stacking.

[0042]FIG. 1, illustrates at least one thin photosensitive polymer layer12, over a support sheet 10. The photosensitive polymer layer 12, can beon one side or both sides of the support sheet 10. The support sheet 10,can be a thin metal sheet or a polymer/plastic sheet 10. It is preferredthat the metal sheet 10, be selected from a group comprising stainlesssteel, nickel, aluminum, molybdenum, permalloy (alloy of Ni and Mo), toname a few. It is preferred that the support sheet 10, be selected froma group comprising polymer, plastic, polyester, PEN (PolyethyleneNaphthalate), to name a few. However, for the support sheet 10, onecould even use paper, such as, a coated or uncoated paper, for example,wax paper, silicone or acrylic coated paper, to name a few.

[0043] For the preferred embodiment one would use a cold rolled thinmetal sheet 10, as shown in FIG. 1, and form openings 22, through thephotosensitive polymer 12, as illustrated in FIG. 2.

[0044] Using conventional photo-processing techniques one would thenform at least one through-hole 22, in the thin metal sheet 10, as shownin FIG. 2. The holes or openings 22, are on a grid, i.e., essentiallythe thin metal sheet 10, will have holes 22, for every via that is goingto be formed in every layer of the MLC structure of this invention.

[0045]FIG. 3, also illustrates an optional step of adhering a layer 30,in the open areas of the thin metallic sheet 10. The metal sheet 10, canbe treated with the layer 30, so that structure could have a firmer orbetter bond with a green sheet. The treatment can be a chemical or amechanical process. A chemical process could include oxidation of thesurface, whereas a mechanical process could include spraying, coating,etc. of an adhesive onto the surface. It should be noted that thetreatment could be on one or more selected surfaces, and does not haveto be on all the exposed surfaces. Through-hole 32, in FIG. 3, is thesame as hole 22, except that it has the optional treatment 30.

[0046]FIG. 4, illustrates the insertion of at least one paste 40, in theopening 32, to form a personalized carrier 45. The bonding paste 40,could be screened or extruded into the hole 32, in the thin metal sheet10. The bonding paste 40, can be a fugitive paste (i.e. that it containsonly organic materials) or a paste 40, that contains dielectricinorganic or conductive polymers. The basic purpose of the paste 40,includes bonding of the thin metal sheet 10, to a green sheet 50, inareas where vias in the green sheet 50, may be formed, as more clearlyillustrated in FIG. 5.

[0047] As shown in FIG. 5, the sub-lamination of the green sheet 50, tothe personalized carrier 45, minimizes the radial movement of a via ingreen sheets 50, when the green sheets 50, are subsequentlypersonalized. This is due to the fact that the bonding paste 40, in thevias 42, gets anchored or pinned to the green sheet 50, and thisanchoring or pinning substantially reduces and/or eliminates any radialmovement between the green sheet 50, and the support sheet 10. The greensheet 50, can be of any thickness, however, it is preferred that thegreen sheet 50, be less than 6 mils, as that would define the greensheet 50, to be a thin sheet.

[0048] The term thin green sheet as used herein is a relative measureand it means as thin as one could preform to as thin as one could handlethrough via forming technique like mechanical punching or laser holeformation or very intensive chemical technique such as photo-processing.

[0049] The bonding and/or tacking of the thinner green sheet 50, to thecarrier 45, can be achieved by a variety of processes, such as, forexample, a lamination or sub-lamination process.

[0050] The sub-lamination process is a very low pressure lamination,typically less than about 1000 psi, at temperatures of less than about90° C., for a time period of less than about 5 minutes. Thesub-lamination process besides bonding the carrier 45, to a green sheet50, also provides a very flat and smooth surface which is very helpfulfor the subsequent operations.

[0051]FIG. 6, illustrates the formation of via openings 62, in thestructure shown in FIG. 5. The hole 32, in the metal support sheet 10,may be slightly larger in diameter than the via holes 62, in the greensheet 50. Since there are several thousand vias 62, in a given MLC, thebonding or location pinning of vias 62, are very effective for stabilitycontrol.

[0052] The via openings 62, could be formed by methods well known in theart, such as, punching (mechanical, laser, etc.) or maybe by forming viaopenings in the green sheet 50, if the green sheet 50, is thick enoughto handle via openings without having any degrading effect. Even thoughthe metal support sheet 10, has vias on all grids, the required vias 62,in the green sheet 50, are opened using the corresponding metal via 42,as a guide. The via opening 62, in the green sheet 50, are smallercompared to the via 42, which now has been filled with bonding paste 60,in the side-walls in the thin metal support sheet 10. Thus the viapositional integrity and the bonding of the green sheet 50, to the metalcarrier 10, are maintained.

[0053]FIG. 7, illustrates the filling of the openings 62, in thestructure of FIG. 6, using at least one metal paste 70, to form aninventive structure 75, of this invention. The metal paste 70, would beused to fill at least one via 72. It is preferred that the via 72, isfilled from the side of the green sheet 50, and not from the side of themetal 10. Typically, an electrically conductive paste 70, would bescreened into the via hole 62, and the green sheet 50, would bemetallized with an appropriate pattern 73 and 74. The patterns 73 and74, could be an electrically conductive line 73, or a cap 74, thuspersonalizing the green sheet 50.

[0054]FIG. 8, illustrates the joining of two structures 75, of FIG. 7,to form a multi-layer ceramic (MLC) structure 85. However, severallayers of structure 75, can be bonded thus to form the MLC structure 85.

[0055] It is very important that the bonding and/or tacking process usedto form the MLC structure 85, should not distort the features 73 and 74,located on the green sheets 50. A lamination pressure of less than 800psi and a temperature of less than 90° C. was found suitable for thebonding and/or tacking operation.

[0056] After the bonding/tacking process a multi-media or multi-densitysub-structure 85, was obtained, which comprises of at least two ceramiclayers 50, with at least two carriers 45. The structure 75, looks andbehaves as a single green sheet layer 50. The sub-structure 75, has viahole 72. Furthermore, the metallized vias 72, are very well aligned withthe via 73, and via 74, and thus enable top to bottom alignment whenstacked. These unique features of this invention enable the handling ofthe thin ceramic sheet 10, as a sub-structure 75.

[0057] Many sub-structures 75, can be built with as many thin greensheets 50, as necessary to build a final MLC laminate 85 or 95. As onecan clearly see in FIG. 7, that the sub-structure 75, has one thin greensheet 50, and this structure 75, has the rigidity for handling throughscreening and stacking. Furthermore, the dimensional stability of thescreened features in thin sheets 50, would be far better when screenedas a sub-structure compared to screened as a free standing thin sheet50.

[0058]FIG. 9, illustrates the joined structures of FIG. 8, after theremoval of the metallic supports. Basically, the MLC structure 85, isstacked and the carrier sheet 45, is separated. For most applicationsthe carrier sheet 45, can be removed by a simple X—Y twist and/orpeeling. This results in a MLC substrate 95, having a green sheet 90,with embedded vias 92, via lines 73, and via caps 74.

[0059] As shown in FIG. 9, the multi-layer multi-density ceramic package95, could be formed by combining, for example, two sub-structures 75,resulting in the ceramic package 85, comprising of at least one thickceramic layer 50, and at least one thin or thick ceramic layer 50. Thetwo sub-structures 75, could then be tacked/bonded to each other andprocessed to form the ceramic package 95.

[0060] The green sheet could have one or more electrically conductivefeatures, such as, for example, cap, line, via, to name a few. Thesefeatures could be made from at least one electrically conductivematerial.

[0061] The electrically conductive material used with this invention ispreferably selected from a group comprising copper, molybdenum, nickel,tungsten, metal with glass frit, metal with glass grit, to name a few.

[0062] The material for the ceramic green sheet is preferably selectedfrom a group comprising alumina, alumina with glass frit, borosilicateglass, aluminum nitride, glass ceramic, to name a few.

[0063] The tacking and/or bonding could be done in a chemicalenvironment, and wherein the chemical is preferably selected from agroup comprising water, methanol, methyl-iso-butyl ketone, isopropylalcohol, alumina, aluminum nitride, borosilicate, glass ceramic, copper,molybdenum, tungsten, nickel, to name a few.

[0064] Another advantage of this invention is the ability to punch,screen and stack very dense via and pattern in a package. As the via andpattern metal density increases in a green sheet (thick or thin) thefeature radial error increases as well when one handles the green sheetsas a free standing body. In such instances one could use the same orsimilar process as described and illustrated in FIGS. 1 through 7.Basically, the dense patterns are screened on the ceramic sub-structuresrather than on the free standing ceramic green sheets. It has been foundthat the shrinkage and distortion is far smaller when sub-structures arescreened than when the free standing green sheets are similarlyprocessed. Furthermore, the sub-structures are built using the normalgreen sheet materials and the existing electrically conductivemetal/composite pastes.

[0065] While the present invention has been particularly described, inconjunction with a specific preferred embodiment, it is evident thatmany alternatives, modifications and variations will be apparent tothose skilled in the art in light of the foregoing description. It istherefore contemplated that the appended claims will embrace any suchalternatives, modifications and variations as falling within the truescope and spirit of the present invention.

What is claimed is:
 1. A method for fabricating a ceramic substratecomprising the steps of: (a) applying at least one thin photosensitivepolymer layer over a support sheet, (b) forming at least one opening insaid thin photosensitive polymer layer and said support sheet, (c)filling said at least one opening with at least one electricallynon-conductive paste, (d) placing at least one green sheet over said atleast one photosensitive polymer layer and said paste, (e) opening atleast one through-hole through said green sheet, such that at least aportion of said electrically non-conductive paste remains adhered to atleast a portion of the side-wall, (f) filling said opening with at leastone electrically conductive paste, and thereby fabricating said ceramicsubstrate.
 2. The method of claim 1, wherein at least one of thematerial for said electrically conductive paste is selected from a groupconsisting of copper, molybdenum, nickel, tungsten, metal with glassfrit and metal with glass grit.
 3. The method of claim 1, wherein afterstep (b), an intermediate step of coating at least a portion of saidsupport sheet with at least one material.
 4. The method of claim 1,wherein after step (b), an intermediate step of coating at least aportion of said support sheet with at least one material, and whereinsaid material is selected from a group consisting of metal oxide andpolymer.
 5. The method of claim 1, wherein said support sheet isselected from a group consisting of stainless steel, nickel, aluminum,molybdenum, permalloy (alloy of Ni and Mo), polymer, plastic, polyester,PEN (Polyethylene Naphthalate), paper, coated or uncoated paper, waxpaper, silicone or acrylic coated paper and ceramic.
 6. The method ofclaim 1, wherein at least one of the material for said non-electricallyconductive material is selected from a group consisting of polymer andceramic.
 7. The method of claim 1, wherein the material for said atleast one green sheet is selected from a group consisting of alumina,alumina with glass frit, borosilicate glass, aluminum nitride and glassceramic.
 8. The method of claim 1, wherein the thickness of said greensheet is between about 0.5 mils to about 6.0 mils.
 9. The method ofclaim 1, wherein said green sheet is at least 6 mils thick.
 10. Themethod of claim 1, wherein said tacking and bonding between said greensheet and said carrier is done using means selected from a groupcomprising thermal means, mechanical means or chemical means.
 11. Themethod of claim 1, wherein during step (d) said tacking and bonding isdone at a temperature of less than about 90° C.
 12. The method of claim1, wherein during step (d) said tacking and bonding is done at apressure of less than about 800 psi.
 13. The method of claim 1, whereinduring step (d) said tacking and bonding is done in a chemicalenvironment, and wherein said chemical is selected from a groupcomprising water, methanol, methyl-iso-butyl ketone, isopropyl alcohol,alumina, aluminum nitride, borosilicate, glass ceramic, copper,molybdenum, tungsten and nickel.
 14. The method of claim 1, wherein atleast one of said electrically conductive feature on said green sheet isselected from a group consisting of cap, line or via.
 15. The method ofclaim 1, wherein at least a portion of at least one of saidnon-conductive feature in said support sheet is anchored to at least aportion of said green sheet.
 16. A ceramic substrate comprising at leastone green sheet with at least one via hole having at least oneelectrically conductive material in intimate contact with at least onecarrier support sheet, and wherein said carrier support sheet has atleast one via opening which is filled with an electrically conductivematerial and an electrically non-conductive material and wherein atleast a portion of said at least one electrically conductive material issurrounded by at least a portion of at least one electricallynon-conductive material, and thereby forming said ceramic substrate. 17.The substrate of claim 16, wherein at least one of the material for saidelectrically conductive material is selected from a group consisting ofcopper, molybdenum, nickel, tungsten, metal with glass frit and metalwith glass grit.
 18. The substrate of claim 16, wherein at least aportion of said support sheet has at least one coating of at least onematerial.
 19. The substrate of claim 16, wherein at least a portion ofsaid support sheet has at least one coating of at least one material,and wherein said material is selected from a group consisting of metaloxide and polymer.
 20. The substrate of claim 16, wherein said supportsheet is selected from a group consisting of stainless steel, nickel,aluminum, molybdenum, permalloy (alloy of Ni and Mo), polymer, plastic,polyester, PEN (Polyethylene Naphthalate), paper, coated or uncoatedpaper, wax paper, silicone or acrylic coated paper and ceramic.
 21. Thesubstrate of claim 16, wherein at least one of the material for saidnon-electrically conductive material is selected from a group consistingof polymer and ceramic.
 22. The substrate of claim 16, wherein thematerial for said at least one green sheet is selected from a groupconsisting of alumina, alumina with glass frit, borosilicate glass,aluminum nitride and glass ceramic.
 23. The substrate of claim 16,wherein the thickness of said green sheet is between about 0.5 mils toabout 6.0 mils.
 24. The substrate of claim 16, wherein said green sheetis at least 6 mils thick.
 25. The substrate of claim 16, wherein atleast one of said electrically conductive feature on said green sheet isselected from a group consisting of cap, line or via.
 26. The substrateof claim 16, wherein at least a portion of at least one of saidnon-conductive feature in said support sheet is anchored to at least aportion of said green sheet.
 27. A ceramic substrate comprising at leastone green sheet with at least one via hole having at least oneelectrically conductive material in intimate contact with at least onemetal carrier support sheet, and wherein said metal carrier supportsheet has at least one via opening which is filled with an electricallyconductive material and an electrically non-conductive material andwherein at least a portion of said at least one electrically conductivematerial is surrounded by at least a portion of at least oneelectrically non-conductive material, and thereby forming said ceramicsubstrate.
 28. The substrate of claim 27, wherein at least one of thematerial for said electrically conductive material is selected from agroup consisting of copper, molybdenum, nickel, tungsten, metal withglass frit and metal with glass grit.
 29. The substrate of claim 27,wherein at least a portion of said support sheet has at least onecoating of at least one material.
 30. The substrate of claim 27, whereinat least a portion of said support sheet has at least one coating of atleast one material, and wherein said material is selected from a groupconsisting of metal oxide and polymer.
 31. The substrate of claim 27,wherein said support sheet is selected from a group consisting ofstainless steel, nickel, aluminum, molybdenum and permalloy (alloy of Niand Mo).
 32. The substrate of claim 27, wherein at least one of thematerial for said non-electrically conductive material is selected froma group consisting of polymer and ceramic.
 33. The substrate of claim27, wherein the material for said at least one green sheet is selectedfrom a group consisting of alumina, alumina with glass frit,borosilicate glass, aluminum nitride and glass ceramic.
 34. Thesubstrate of claim 27, wherein the thickness of said green sheet isbetween about 0.5 mils to about 6.0 mils.
 35. The substrate of claim 27,wherein said green sheet is at least 6 mils thick.
 36. The substrate ofclaim 27, wherein at least one of said electrically conductive featureon said green sheet is selected from a group consisting of cap, line orvia.
 37. The substrate of claim 27, wherein at least a portion of atleast one of said non-conductive feature in said support sheet isanchored to at least a portion of said green sheet.